Micro Etchant for Imaging
Micro Etchant for Imaging[DFR & PSR]
| Etchbrite 519[H2SO4+H2O2] | |
|---|---|
| Application [적용공정] |
DFRfor Inner & Outer layers |
| Working sol. 사용액 |
H2SO4 6% + H2O2 4% + EB529 10%[2% w/new] |
| Temp. 40℃ [30~40℃] | |
| Dwell time. 40sec[30~60sec] | |
| Chloride [염화물] |
No chloride |
| Type [종류] |
EB 529C Concentrate |
| Etchbrite 535[HCL] | |
|---|---|
| Application [적용공정] |
Solder Mask & DFR |
| Working sol. 사용액 |
100% make up |
| Base 기초용액 |
HCL Base |
| Type [종류] |
EB 535M for make up |
| EB 535R for replenish | |
| New version [신제품] |
ComEtch V9 will come January 2011. Running at 1st customer for mass production[2011년 1월 출시예정] |
Micro Etchant CornEtch V9
Cross Cut for SM
(after 30min. Dipping at 10% HCL solution)
(after 30min. Dipping at 10% HCL solution)
Micro Etchant EB 519
Uniplated Copper
(after micro etching)
(after micro etching)